2、Allegro Cadence PCB设计高级
培训目标:
Cadence培训高级班将首先让您了解CB板上出现的信号反射、串扰、电源/地平面干扰、时序匹配以及电磁兼容性等一系列问题产生的机理,并掌握其解决方法;然后讲解并上机练习Cadence的高速 PCB设计与仿真工具SPECCTRAQuest的使用。使您在硬件设计过程中,能够达到“设计即正确”的目的。
培训大纲:
1 高速PCB设计中的理论基础
传输线理论、信号完整性(反射、串扰、过冲、地弹、振铃等)、电磁兼容性和时序匹配等等。
2 SPECCTRAQuest设计流程
2.1 Pre-Placement
2.2 Board Setup Requirements for Extracting and Applying Topologies
2.3 Database Setup Advisor
—Cross-Section
—DC Nets
—DC Voltages
—Device Setup . ??—SI Models
—SI Audit
3 拓扑结构的抽取与仿真 Extracting and Simulating Topologies
3.1 Pre-Route Extraction Setup—Default Model Selection.
3.2 Pre-Route Extraction Setup—Unrouted Interconnect
3.3 Pre-Route Template Extraction
3.4 SQ Signal Explorer Expert
3.5 Analysis Preferences
3.6 SigWave
3.7 Delay Measurements
4 确定和施加约束 Determining and Adding ConstraintsSolution
4.1 Solution SpaceAnalysis: Step 1 to 6
4.2 Parametric Sweeps.
4.3 Constraints
4.4 Usage of Constraints Defined in Topology Template
5 模板应用和基于约束的布局
Template Applications and Constraint-Driven Placement
5.1 Creating a Topology
5.2 Wiring the Topology
5.3 TLines and Trace Models
5.4 Coupled Traces
5.5 RLGC Matrix of Coupled Trace Models
5.6 Crosstalk Simulation in SQ Signal Explorer Expert
5.7 Simulating with Coupled-Trace Models
5.8 Sweep Simulation Results with Coupled-Trace Models
5.9 Extracting a Topology Using the Constraint Manager
5.10 Electrical Constraint Set
5.11 Applying Electrical CSet
5.12 Worksheet Analysis
5.13 Spacing and Physical Rule Sets
5.14 Electrical Rule Set
6 基于约束的布线 Constraint-Driven Routing
6.1 Manual Routing
6.2 Routing with the SPECCTRA Smart Route
6.3 Driving Constraints in Routing
7 布线后的DRC检查和分析 Post-Route DRC and Analysis
7.1 Post-Route Analysis
7.2 SigNoise
7.3 Reflection Simulation
7.4 Reflection Waveform Analysis
7.5 Comprehensive Simulation
7.6 Crosstalk Simulation
7.7 Crosstalk Analysis
7.8 Simultaneous Switching Noise Simulation
7.9 SSN Waveform Analysis
7.10 System-Level Analysis
7.11 A Complete Design Link
7.12 Initialize Design Link
8 差分信号设计 Differential Pair Design Exploration
8.1 Types of Differential Pairs in SPECCTRAQuest
8.2 Create Differential Pair Using SPECCTRAQuest
8.3 Create Differential Pair Using Constraint Manager
8.4 Assigning Differential Pair Signal Models
8.5 Preference to Extract Unrouted Differential Pair Topology
8.6 Extracting Unrouted Differential Pair Topology
8.7 Custom Stimulus to Analyze Differential Pair Topology
8.8 Differential Pair Topology Analysis
8.9 Coupled Trace Model and Differential Pair Topology
8.10 Layout Cross-section Editor
8.11 Differential Pair Constraints
8.12 Differential Pair Constraints in the Constraint Manager
8.13 Differential Pair Analysis in the Constraint Manager
8.14 Post Route Extraction
9.SI 仿真
9.1 时序仿真
9.2 差分仿真
9.3 反射仿真
9.4 Crosstalk串扰仿真
9.5 EMI
10 PI 电源完整性仿真
10.1 电源完整性工具
10.2 电容器和单节点仿真流程
11.多板仿真
11.1 DesinLik模型创建
11.2 多板仿真
12.后仿真
12.1 反射仿真
12.2 综合仿真
12.3 SSN同步开关噪声仿真
12.4 串扰仿真
13.EMI/EMC仿真
13.1 仿真要点
13.2 仿真流程
14. IR-DROP电源压降仿真
电磁兼容设计的关系 |